複雑なマイクロエレクトロニクス向けに設計された、拡張性の高い技術

デモを見る

Up to 1,000,000 printed connections per second

インパルス印刷™テクノロジー

Step-by-step

あらゆる素材

Rapid heating instantaneously propels any ink or paste

どんなサイズでも

Non-contact deposition of micron-sized patterns in parallel

あらゆる基材

Forming 3D interconnects upon impact with any substrate

From advanced chip packaging to display assembly

Wrap-around electrodes: 40 µm lines

Chip interconnects: 40 µm lines on 150 µm thick chip

Pillars: 45 µm diameter, multi-layer print

Bridging: 70 µm lines, multi-layer print