适用于复杂微电子器件的可扩展技术

Up to 1,000,000 printed connections per second

脉冲打印™技术

Step-by-step

任何材料

Rapid heating instantaneously propels any ink or paste

任何尺寸

Non-contact deposition of micron-sized patterns in parallel

任何基材

Forming 3D interconnects upon impact with any substrate

From advanced chip packaging to display assembly

Wrap-around electrodes: 40 µm lines

Chip interconnects: 40 µm lines on 150 µm thick chip

Pillars: 45 µm diameter, multi-layer print

Bridging: 70 µm lines, multi-layer print