복잡한 마이크로일렉트로닉스를 위해 설계된 확장 가능한 기술

Up to 1,000,000 printed connections per second

Impulse Printing™ 기술

단계별로

모든 재료

Rapid heating instantaneously propels any ink or paste

모든 사이즈

Non-contact deposition of micron-sized patterns in parallel

모든 기질

Forming 3D interconnects upon impact with any substrate

From advanced chip packaging to display assembly

Wrap-around electrodes: 40 µm lines

Chip interconnects: 40 µm lines on 150 µm thick chip

Pillars: 45 µm diameter, multi-layer print

Bridging: 70 µm lines, multi-layer print